CrossBar's memory products deliver unprecedented scaling performance, density, and power efficiency for AI, IoT, and secure computing applications.
ReRAM’s compact architecture supports terabyte-scale on-chip storage with minimal layout overhead. Its patented selector enables ultra-dense, stackable 3D cross-point arrays for efficient integration.
About CrossBar About ReRAMReRAM’s CMOS-compatible, stackable architecture enables direct logic-memory integration, delivering 2× higher density while reducing interconnects, latency, and power.
Data StorageReRAM offers 1,000× endurance, 100× faster reads, and 1,000× faster writes. Built for advanced computing, it scales below 10nm and integrates with CMOS foundry flows.
Mobile ComputingReRAM uses 5× less energy than eFlash, 20× less than NAND, 30× less than SPI Flash, and 40× less than BLE.
Internet of ThingsReRAM endures 1M+ write cycles, retains data for 10 years at 85°C, and operates from –40°C to 125°C in harsh environments.
SecurityNow in production at 40nm. License CrossBar ReRAM IP to build custom ICs with optimized power, density, security, and performance across diverse applications.
3D memory arrays scale from GBs to TBs.
20ns read, 12μs write, no erase latency.
Up to 50% lower energy with sub-mW active power.
Prevents extraction and supports secure keys.
Designed to bridge embedded and storage-class memory needs, aligning with the most demanding future chip architectures.
Collaborate with CrossBar Engineers
How ReRAM enables real-time AI processing at the edge
Ultra-low power memory for battery-operated devices
Tamper-resistant storage for cryptographic keys
Tamper-resistant storage for cryptographic keys
Latest developments in resistive random-access memory technology
